Chip Title
Multifunctional BioChip for Stem Cell Research: High-Resolution Capacitive Sensing Array Based on Integrated Fusion-Pixel Architecture
Application
Life science / Stem cells / Dielectrophoresis(DEP) / Capacitive Sensing(CS)
Designer
L.-H. Lai, F.-J. Chang, S.-H. Lian , H.-C. Peng
Technology / Core Area
TSMC 180nm / 27.73 mm2
Maximum Frequency / Power
10MHz / 589 mW
Submission
Chip Title
A 2.56-us Range, 31.25-ps Step Digital-to-Time Converter in 180-nm CMOS for Bio-Chip of High Resolution Capacitive Sensor
Application
Life science / Stem cells / Capacitive Sensing(CS)
Designer
H.-Y. Lui, L.-H. Lai
Technology / Core Area
TSMC 180nm / 2.1 mm2
Maximum Frequency / Power
7.9MHz / 119mW
Submission
ISCAS 2024
Chip Title
128*128 DEP Electrode Array for Cell Quality Assurance
Application
Life science / Stem cells / Dielectrophoresis(DEP)
Designer
W.-Y. Lin, L.-H. Lai
Technology / Core Area
TSMC 180nm / 1.89 mm2
Maximum Frequency / Power
10MHz / 21.73mW
Submission
ISCAS 2024
Chip Title
460,800 pixels CMOS capacitive sensor array with programmable fusion pixels (V2)
Application
Life science / stem cells
Designer
L.-H. Lai, W.-Y. Lin, Y.-W. Lu, H.-Y. Lui
Technology / Core Area
TSMC 180nm / 9.25 mm2
Maximum Frequency / Power
10MHz / 4.674 mW
Submission
Chip Title
460,800 pixels CMOS capacitive sensor array with programmable fusion pixels
Application
Life science / stem cells
Designer
L.-H. Lai, W.-Y. Lin, Y.-W. Lu, H.-Y. Lui
Technology / Core Area
TSMC 180nm / 9.25 mm2
Maximum Frequency / Power
19MHz / 5mW
Submission
ISCAS 2023 / TCAS II
TBioCAS
Chip Title
DCO-based capacitive biosensor with sub-Femto farad resolution for fast medical detection
Application
Fast medical detection
Designer
L.-H. Lai, W.-Y. Lin
Technology / Core Area
TSMC 180nm / 0.165 mm2
Maximum Frequency / Power
160MHz / 86mW
Submission